Indium Launches New Halogen-Free, Ultra-Low Voiding Indium10.1HF Solder Paste


Reading time ( words)

Indium Corporation has launched Indium10.1HF, a new solder paste specifically formulated to achieve ultra-low voiding in bottom termination component (BTC) assemblies and improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste with a flux chemistry engineered to improve reliability with:

  • High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
  • Solder beading minimization
  • Very low bridging, slump, and solder balling
  • Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
  • High print transfer efficiency with low variation

Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.

For more information about Indium10.1HF Solder Paste, visit www.indium.com/indium10.1HF.

Share


Suggested Items

RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared

05/25/2018 | Real Time with...IPC
Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

Indium's Karthik Vijay Talks Engineering for Automotive Applications

01/22/2018 | Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.



Copyright © 2018 I-Connect007. All rights reserved.