Heraeus Electronics Opens New North America SMT Customer Applications Lab


Reading time ( words)

Heraeus Electronics has announced the opening of its new SMT Applications Lab at its facility in West Conshohocken, Pennsylvania. The multi-million-dollar investment includes a complete in-line automated SMT assembly line that customers can utilize to optimize processes, collaborate on product development and conduct trouble-shooting on industry issues.

The SMT Customer Applications Lab provides a comprehensive range of testing capabilities, including:

  • Product/process defect analysis, root-cause & corrective action (RCCA)
  • SEM/EDX Spectroscopy – (Scanning Electron Microscopy with Energy Dispersive X-Ray)
  • FTIR – Fourier Transform Infrared Spectroscopy
  • TGA – Thermo gravimetric Analysis
  • DSC – Differential Scanning Calorimetry
  • Die-penetration testing, cross-sectioning, CT-X-Ray
  • Pull & Sheer testing, wire-bond testing
  • Cross Sectioning & analysis
  • Stress and strain analysis

One of the many highlights of the new lab is its climate-controlled clean room. With the unique ability to match customer environmental conditions regardless of region, Heraeus is able to systematically optimize associated processes and successfully develop products to better match customer requirements. In addition to the clean room, the lab includes a comprehensive array of state-of-the-art equipment to provide the highest level of support, including:

  • ASM Assembly Systems’ DEK Horizon Printer
  • Parmi SIGMAx Blue, Solder Paste Inspection
  • Assembly Systems' E by SIPlace placement platform
  • Dage Sheer Tester
  • Rehm 10 zone reflow oven

This facility is the fifth site of a global network of regional labs strategically located in key markets to provide customers with direct access to Heraeus technical support. The investment exemplifies the commitment of Heraeus Electronics to go far beyond manufacturing and serve as a strategic partner and solutions provider for customers in the growing SMT industry. The SMT Customer Applications Lab in West Conshohocken will enable Heraeus to work collaboratively with customers to resolve specific performance challenges, manage joint development projects and support the design and simulation of processes.

“This investment is based on our two most important guiding principles: innovation and partnership,” said Frank Stietz, President of Heraeus Electronics. He added, “North America is a key market for us. Having a local lab will allow customers to easily tap into our technologies and technical experts to solve their most complex systems and materials challenges, as well as help them capitalize on innovation opportunities.”

Heraeus Electronics will be exhibiting at the 2017 Surface Mount Technology Association (SMTAi) International Conference & Exhibition, which will take place September 19-20 at the Donald Stephens Convention Center in Rosemont, Illinois. Customers will have the opportunity to take a virtual tour of the lab as well as a demonstration of the equipment by several of the lab’s manufacturers.  

About Heraeus

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. With expertise, a focus on innovations, operational excellence and an entrepreneurial leadership, we strive to continuously improve the businesses of our customers around the world.

We create high-quality solutions for our customers and strengthen their long-term competitiveness by combining material expertise with technological know-how. Our ideas are focused on important issues such as the environment, energy, health, mobility and industrial applications. Our portfolio ranges from components to coordinated material systems which are used in a wide variety of industries, including the steel, electronics, chemical, automotive and telecommunications industries.

In the 2016 financial year, the FORTUNE Global 500 listed company generated revenues without precious metals of €2.0 bn and a total revenue of €21.5 bn. With approximately 12,400 employees worldwide in more than 100 subsidiaries in 40 countries, Heraeus holds a leading position in its global markets. In 2016, the Foundation for Family Businesses named Heraeus as one of the “Top 10 Family Businesses” in Germany.

About Heraeus Electronics

Heraeus Electronics - a Global Business Unit of the Heraeus Group - is one of the leading manufacturers of materials for the packaging of integrated circuits in the electronics industry. The company deals with sophisticated material solutions for semiconductor and automotive industry, consumer goods, energy, industry electronics as well as communications and telecommunications. Core competences include bonding wires, assembly materials, thick film pastes, as well as roll clad strips and substrates.

For more information about this event and Heraeus Electronics, please click here.  

Share


Suggested Items

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance

12/28/2017 | Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.



Copyright © 2018 I-Connect007. All rights reserved.