RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing


Reading time ( words)

During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, talks with I-Connect007 Managing Editor Stephen Las Marias about their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.

Staedtler also discusses how microdispensing can complement solder paste printing in the SMT line.

Watch The Interview Here

Share

Print


Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.



Copyright © 2019 I-Connect007. All rights reserved.