RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing


Reading time ( words)

During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, talks with I-Connect007 Managing Editor Stephen Las Marias about their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.

Staedtler also discusses how microdispensing can complement solder paste printing in the SMT line.

Watch The Interview Here

Share




Suggested Items

The ‘Intel’ on Advanced Packaging Options

11/29/2022 | Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?

Time to Go ‘Exploring’ at SMTA International

10/19/2022 | Michelle Te, I-Connect007
Students, young professionals, and industry newcomers will have a unique way to network with subject matter experts at SMTA International 2022 in a fun and non-threatening way. “Passport to the World of SMT” is designed to assist “Explorers” in making connections with exhibitors during part of the annual trade show in Minneapolis.

It’s an Exciting Time in Electronics

10/06/2022 | Sal Sparacino, SMTA
SMTA International is just around the corner, and we are excited to be meeting fully in person and onsite. The conference and expo runs from Monday, Oct. 31 through Thursday, Nov. 3, returning to the Minneapolis Convention Center. Once again, we will co-locate with Medical Design & Manufacturing Minneapolis 2022 (MD&M). As the world continues to adjust to the new normal following nearly years of the pandemic, an in-person industry conference and exhibition is more valuable than ever.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.