RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing


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During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, talks with I-Connect007 Managing Editor Stephen Las Marias about their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.

Staedtler also discusses how microdispensing can complement solder paste printing in the SMT line.

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