RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing


Reading time ( words)

During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, talks with I-Connect007 Managing Editor Stephen Las Marias about their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.

Staedtler also discusses how microdispensing can complement solder paste printing in the SMT line.

Watch The Interview Here

Share


Suggested Items

Improving Design, Manufacturing and Assembly Teamwork

01/15/2018 | Syrma Technology
Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.

Recent Innovations in DFMA

01/10/2018 | Syrma Technology
Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.

Blockchain for Manufacturing: What are the Opportunities?

11/17/2017 | Neil Sharp, JJS Manufacturing
Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?



Copyright © 2018 I-Connect007. All rights reserved.