Yamaha Motor Launches High-end Hybrid AOI System


Reading time ( words)

Yamaha Motor Europe IM has launched the YSi-V 12M TypeHS2 high-end hybrid AOI system. As the successor to the YSi-V 12M TypeHS, this new very high-speed specification model features increased speed and precision, as well as enhanced specular component inspection capacity/performance.

Development of the YSi-V 12M TypeHS2 aimed for faster processing through improved image processing hardware and image inspection algorithms, and has achieved a more than a 20% increase in three-dimensional inspection speed compared to the existing model. In particular, the new model delivers a significant speed increase of approximately 40% compared to the existing model in printed circuit boards (PCBs) with many component mounting points.

New features include a high-precision mode, enabling capture of clear three-dimensional images. The high-precision 7 μm resolution type includes an all-new-design dedicated three-dimensional image capture projector optical system, significantly improving form reproducibility of extremely small-sized components down to 0201 (0.25 x 0.125mm), and increasing height measurement repeatability.

Furthermore, the optimization of image capture parameters and the employment of newly-developed algorithms has enabled inspection capacity/performance compatible with thin, highly-integrated WLCSP and FOWLP components, whose use on the market has risen dramatically since last year.

The YSi-V 12M TypeHS2 will be showcased at Productronica 2017, an electronics manufacturing and mounting technology exhibition to be held from November 14–17, 2017 in Munich, Germany.

About Yamaha Motor IM

Yamaha Motor IM is a subdivision of Yamaha Motor Corporation. Yamaha IM surface mounters are highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.

Yamaha Motor IM has created a strong business in the surface mounter industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha Motor IM to offer a full line of machines for electric/electronic parts mounting and

propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.

Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients. For more information, click here.

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.



Copyright © 2017 I-Connect007. All rights reserved.