Viscom Adopts Valor Process Preparation Solution for Electronics Manufacturing Efficiency

Reading time ( words)

Viscom AG has announced the adoption of the Valor Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.

One of the more challenging tasks of operating AOI machines is the creation of robust inspection algorithms for new and non-standard parts that have not been inspected on previous boards. Even for medium-sized boards, it can take some additional time to create a program with new parts. And for large designs, this additional effort can be significant. The combination of Viscom vVision and Valor Process Preparation creates a solution for this challenge.

The rules-driven auto-generation capability of Valor Process Preparation can create the regions of interest that the vVision machine needs to apply the optimum inspection algorithms. This data is usually created manually, which may delay the introduction of new parts. The Valor Parts Library (VPL) comprises shape geometries based on manufacturing part numbers (MPNs) from a central database.

The vVision inspection content also can be provided from the SMT placement libraries. All shapes are kept in a neutral format that can then be generated into machine-specific shapes using the Valor auto-generate feature, including those of ASM, Fuji, Juki, Panasonic and Yamaha, providing the Viscom vVision machine with a rich data set of PCB footprint and component package information. This significantly reduces the time to create inspection templates for new parts.

"Our proven Valor Process Preparation product will enhance the yield and productivity of Viscom's customers so we are honored that our technology is being utilized in the vVision AOI and SPI systems," says Dan Hoz, general manager of the Valor Division of Mentor. "We expect that customers using Viscom’s machines will realize immediate productivity gains to meet competitive first-to-market goals."

"The Valor tool and its package library are invaluable for further speeding up managing new parts," says Detlef Beer, senior manager of product engineering, Viscom. "Our initial test results show that using Valor Process Preparation will reduce time on the machine to help our customers manufacture their electronics products with improved speed and efficiency."

About Viscom

Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, click here.


Suggested Items

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

07/11/2018 | Stephen Las Marias, I-Connect007
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.

West Penn SMTA: New Leadership, Same Commitment

06/28/2018 | Patty Goldman, I-Connect007
SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Copyright © 2018 I-Connect007. All rights reserved.