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Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.
In this interview during the recent SMTA International 2017 exhibition this week, D’Amico explains how MIRTEC is helping customers address these inspection issues. He also highlights their latest developments in inspection technologies, including solder paste inspection (SPI) and automated optical inspection (AOI) systems, to stay ahead of the curve.
Watch The Interview Here
Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.
Stephen Las Marias, I-Connect007
Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.
Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.