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Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.
In this interview during the recent SMTA International 2017 exhibition this week, D’Amico explains how MIRTEC is helping customers address these inspection issues. He also highlights their latest developments in inspection technologies, including solder paste inspection (SPI) and automated optical inspection (AOI) systems, to stay ahead of the curve.