SMART Group and NPL Host Process, Design & Reliability Seminar


Reading time ( words)

SMART Group announces that it is co-sponsoring the Process, Design & Reliability Seminar on 9 November with the NPL.

The full-day event will take place at the NPL facility in Teddington, UK, and will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high-temperature reliability for alternative solders and substrates materials.

Presentation topics include the following:

  • Whisker Mitigation: 1000 Days of Testing to Evaluate Conformal Coatings
  • Performance and Lifetime of Printed Semiconductors
  • Condensation Failure and Improved Testing for Electronic Assemblies
  • High-Temperature Electronics and Their Reliability
  • Factors Affecting Moisture Diffusion in PCBs
  • UV Non-Destructive Coating Thickness Measurement System
  • Coatings for High-Temperature Applications
  • Effect of Production Process and Laminate Materials on Conductive Anodic Filament (CAF) Failure
  • Best Methods to Evaluate Assembly Reliability
  • How to Test and What to Expect in Terms of Failure with Different Test Methods

Each attending delegate will have the opportunity to access the Groups Report Database to download free reports on many of the projects

To book a place and for further information about the seminar, click here. To book a tabletop exhibition space, click here. Additionally, for further information about either the exhibition or the seminar, email Keith Bryant at info@smartgroup.org.

Share


Suggested Items

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2017 I-Connect007. All rights reserved.