BEST Releases Sustainable Version of J-STD-001 Soldering Kit

Reading time ( words)

BEST Inc. has released an updated version of the Revision "F" IPC-JSTD-001 training kit. This kit is used in IPC training classes so associates can get certified to the standard. It features the boards and components needed for classroom practice and learning-all in a neatly-packaged box.

Not only does this kit meet the requirements for the training but the kit box itself has a purpose after the class is done. It can be used to store components or materials in the associates work area. BEST has even developed a sustainability program for larger orders where the kit containers can be re-used by refilling them thereby saving the plastic containers from the landfill.

Alex Conley, product manager for training services, says, "Customers really like the fact that the components are so neatly packaged and present themselves well in the classroom."

Products can be purchased directly, at Amazon, or at its company store at

About Business Electronics Soldering Technologies (BEST)

Headquartered in Rolling Meadows, Illinois BEST is a master IPC-certified solder and wire harness training center certifying students and instructors in IPC-A-620, J-STD-001, IPC-A-610 and IPC 7711/21. Training takes place in Chicago, Minneapolis, Detroit, Cleveland and near Nashville, TN. In addition BEST is a supplier of PCB rework and repair services as well as tools for those services in the communications, computer, industrial, automotive, avionic and military sectors.


Suggested Items

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

RTW IPC APEX EXPO: Developments and Reliability Improvements in Solder Alloys

03/01/2018 | Real Time with...IPC
Tim O'Neill explains developments in solder alloys for cost-sensitive applications, and improvements in the reliability of alloys subjected to sustained high temperatures.

Copyright © 2018 I-Connect007. All rights reserved.