AIM to Participate at SMT – Info International Conference in Czech Republic


Reading time ( words)

AIM Solder will present two of its most recent technical papers at the SMT – Info International Conference, scheduled to take place on October 17–18, 2017, in Brno, Czech Republic.

Petr Bettinec will present the paper "The Evolution and Development of High Reliability Lead Free Alloys", which details the limitations of SAC305, the de facto standard for lead-free electronics soldering, and explores the effects of nickel, bismuth and other micro-alloy dopants on mechanical and soldering performance. New solder alloys with relatively low melting temperatures (compared to SAC305) and improved thermal and mechanical performance which retain the positive characteristics of SAC alloys are discussed.

Ales Sedlak's presentation, titled "Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction," will assess the impact of stencil modifications that can be easily deployed in an effort to consistently and repeatedly reduce void formation on BTC style devices. The paper will detail a study using a common SAC305 no-clean solder paste with a novel stencil design which varies solder paste deposit volume and location and will evaluate the impact on ground pad void characteristics.

Additionally, AIM will highlight its full line of advanced solder materials, including its newly developed high reliability alloys, REL61 and REL22, as well as AIM solder paste, liquid flux and related chemistries. AIM REL61 and REL22 alloys address some of the most challenging issues with today’s common lead-free alloys, specifically soldering performance, cost, durability and tin whisker formation. To learn more of AIM's products and services, visit the company at the SMT – Info International Conference for more information.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Indium on Voiding and Auto Electronics Test Standard

10/09/2018 | Stephen Las Marias, I-Connect007
In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.

RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering

09/28/2018 | Real Time With... NEPCON South China
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.



Copyright © 2018 I-Connect007. All rights reserved.