Indium to Feature Low-Voiding Solder Paste at productronica 2017


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Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers avoid the void at productronica 2017, which will be held on November 14–17, in Munich, Germany.

The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:

  • demonstrates consistent printing performance for up to 12 months when refrigerated;
  • maintains excellent printing and reflow performance after remaining at room temperature for one month; and,
  • delivers excellent response-to-pause even after being left on the stencil for 60 hours.

The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.

For more information about Indium Corporation’s low-voiding solder pastes, click here or see Indium Corporation in Hall A4 at Booth 214.

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