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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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Incap’s New CEO to Take Over in October
October 9, 2017 | IncapEstimated reading time: Less than a minute
Incap Corp.'s newly appointed President and CEO Vesa Mäkelä is able to take on the position earlier than announced. In line with this, Mäkelä will commence work in his new position effective October 16, 2017.
In a prior announcement, Mäkelä was to start in his position on December 1, 2017.
Mäkelä has previously served at GS-Hydro Group since January 2015 in Group Sales and Marketing and since March 2016 as Region VP, North and Central Europe. Before that, he has held several managerial positions in Finland and abroad, among others at Konecranes, Valtra and Specma business units and in China.
Mäkelä was elected a member of Incap's board of directors in the annual general meeting held in April 2017, and he will continue in his role as the CEO and as a Board member until the next annual general meeting to be held in spring 2018.
Suggested Items
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
LPKF Extends Contract of CEO Klaus Fiedler until 2028
04/24/2024 | LPKFThe Supervisory Board of LPKF Laser & Electronics SE has decided to extend the contract of Dr. Klaus Fiedler as CEO until 31 December 2028. "Under the leadership of Klaus Fiedler, LPKF has undergone some extensive transformation since he joined just over 2 years ago.
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Schweizer Electronic Appoints Thomas Gottwald as New Member of the Executive Board
04/23/2024 | Schweizer Electronic AGThe Supervisory Board of Schweizer Electronic AG has appointed Mr. Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of 3 years with effect from 1 May 2024.