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Incap Corp.'s newly appointed President and CEO Vesa Mäkelä is able to take on the position earlier than announced. In line with this, Mäkelä will commence work in his new position effective October 16, 2017.
In a prior announcement, Mäkelä was to start in his position on December 1, 2017.
Mäkelä has previously served at GS-Hydro Group since January 2015 in Group Sales and Marketing and since March 2016 as Region VP, North and Central Europe. Before that, he has held several managerial positions in Finland and abroad, among others at Konecranes, Valtra and Specma business units and in China.
Mäkelä was elected a member of Incap's board of directors in the annual general meeting held in April 2017, and he will continue in his role as the CEO and as a Board member until the next annual general meeting to be held in spring 2018.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.
Duane Benson, Screaming Circuits
Sometimes, you can't have reference designators on your board. Perhaps it's because it's too densely populated and there isn't room. Or maybe, for aesthetic reasons, you've chosen to leave them off. Here's how you can address that issue.