Nordson DAGE to Discuss Wafer X-ray Metrology at IWLPC


Reading time ( words)

Nordson DAGE, a division of Nordson Corporation, will exhibit at the 14th Annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place October 24-26, 2017 in San Jose, California. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.

The semiconductor market demands increasingly complex devices that are enabled by technologies such as TSV, PoP, 2.5D and 3D integration. These complex products demand a new level of metrology. Nordson DAGE, the leader in X-ray inspection for the electronics industry, presents the XM8000 X-ray metrology platform, for the fast, fully-automated, non-destructive measurement of, and within, metal features on up to 300 mm wafers.

The XM8000 system delivers fully automated, non-destructive, radiation safe defect detection for all complex devices, and is 30X faster than traditional X-ray. This new platform takes the market-leading capabilities from Nordson DAGE's existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.

About Nordson DAGE

Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award-winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, click here.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web.

Share


Suggested Items

RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow

09/13/2017 | Real Time With... NEPCON South China
Ralf Wagenfuehr of Rehm Thermal Systems speaks about the need for a common communications platform as the industry moves toward Industry 4.0. He also talks about how their new ViCON software can help manufacturers achieve the smart factory vision.

Cybersecurity: 4 Things OEMs Should Do to Protect Themselves

09/01/2017 | Neil Sharp, JJS Manufacturing
Manufacturing has been declared one of the top three most targeted industries for cyber attacks. While Industry 4.0 and expansion into cyber-physical systems will have a positive impact on the industry in terms of increasing efficiency, they open the door to even more security risks such as a hacker taking over production, or changing the output of the manufacturing process.

On the Smart Move: Industry 4.0 in Electronics Production

08/25/2017 | Günter Schindler, ASM Assembly Systems GmbH & Co. KG
The industrial world is in motion, as we face a revolution in terms of processes, organizational structures, hardware and software in our companies. Many critics complain that terms like Industry 4.0 and smart factory are rather arbitrary and lack concrete meaning. That is correct. What is also true, however, is that technical progress always starts out with a vision, which is then put into concrete terms as time moves on.



Copyright © 2017 I-Connect007. All rights reserved.