SMTA Chapters to Co-Host 2nd Annual SMTA New England Expo and Technical Forum


Reading time ( words)

SMTA Connecticut and Boston Chapters will co-host the SMTA New England Expo and Technical Forum on Thursday, November 16, 2017 at the DCU Center in Worcester, Massachusetts. The free-to-attend event for professionals in the electronics manufacturing industry welcomes over 140 exhibiting companies, technical presentations, prize giveaways, and a Live Engineering/Prototype Work Cell.

Speakers from AIM Solder, Nokia (Alcatel-Lucent), KIC, and Raytheon will present their current research on topics including Impact of Lead Free in High Reliability Applications, Global trends on Smart connected and Mechatronic products, The Smart Reflow Oven for the Industry 4.0 Factory, and A Study of the Deficiencies of SAC Solder Alloys and Potential Mitigation Strategies.

Details about the event are posted on the SMTA Connecticut Chapter’s website.

For more information contact Mark Siems: mark@milaerosolutions.com or call 203-953-1276.

SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share


Suggested Items

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.

DFx on High-Density Assemblies

12/01/2017 | Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.



Copyright © 2017 I-Connect007. All rights reserved.