Alpha to Promote New Technologies at SMTA Orange County Expo & Tech Forum


Reading time ( words)

Alpha Assembly Solutions will be promoting its latest low-temperture and low-voiding technologies at the 2017 SMTA Orange County Expo & Tech Forum, taking place on November 2 at The Grand Event Center in Long Beach, California.

The two products to be highlighted during the Expo are Alpha's new low temperature solder paste, ALPHA OM-550 and the innovative void reduction ALPHA AccuFlux BTC-578 Preform System.  Both products are setting new industry standards for performance and relaibility.

Among its many features, ALPHA OM-550 low temperature solder paste reduces warpage up to 99%, increasing production yields and reducing energy consumption.

"This paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability in comparison to other low temp alloys," said Robert Wallace, Regional Marketing Manager for the Americas. "We are very excited about this new paste, as it is a low temperature solution for customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy."

Alpha's AccuFlux BTC-578 Preform System is a low void technology system designed to provide reliable low voiding for bottom terminated components.

"The ALPHA AccuFlux BTC-578 Preform System has been specially designed to dramatically decrease voiding, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge," said Jerry Sidone, Preforms Product Manager at Alpha Assembly Solutions.

In addition, Alpha will also feature its Recycling Services which offers electronic assemblers the safest, most efficient, environmentally-compliant solution for turning production waste streams into revenue for its customers. Capable of processing all varieties of waste materials, Alpha has the technological edge for maximizing the recycling of solder paste and related solder paste debris, including used jars, dispensers, and stencil cleaning paper.

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

Share


Suggested Items

DFx on High-Density Assemblies

12/01/2017 | Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.

Creating the Perfect Solder Joint

11/03/2017 | Stephen Las Marias, I-Connect007
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.

Cleaning Trends: The Challenges of Miniaturization and Proximity

11/01/2017 | Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.



Copyright © 2017 I-Connect007. All rights reserved.