AIM to Highlight Revolutionary Solder Alloy at productronica 2017


Reading time ( words)

AIM Solder will highlight its revolutionary REL61 lead-free solder alloy at the upcoming productronica 2017 event that is scheduled to take place on November 14-17, 2017 at the Messe Müchen in Munich, Germany. AIM will be located in Hall A4 Booth 409.

REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically soldering performance, cost and durability. A low silver/low cost alloy, REL61 not only is more durable than SAC305, but has a wider process window than any low/no silver alloy on the market today. REL61 improves wave and selective soldering performance, addressing sluggish barrel fill issues common to other low/no silver alloys and eliminating costly alloy maintenance and analysis requirements. Extensive testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance. Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity.

AIM will also highlight its full line of advanced solder materials, including solder paste, liquid flux and solder alloys, including its newly developed REL22 solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at Productronica Germany for more information.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.