Choosing Solder Processes: Getting It Right

Reading time ( words)

Las Marias: Finally, Ralf, what are some of the latest innovations from Rehm that will help address this voiding challenge?

Wagenfuehr: We have the condensation soldering system for very high-reliability applications. We have four different kinds of series for each market, so two condensation soldering machines with vacuum. For industries that do not have the possibilities for condensation soldering, where the limitation is the cycle times, then we have vacuum reflow, which features a built-in vacuum into the reflow process, after the peak zone. Here, we can get the escaped voids down to 2%. Those are the products we have in terms of equipment. But our team knows about the process also, and that’s also another factor. So, when you buy with Rehm, you get not only the machine, but the whole support in your production. We are happy to do this to our customers.

Las Marias: Do you have any other final comments?

Wagenfuehr: I think the paste and the component suppliers should collaborate more for the industry to develop in the same direction. Of course, this will help everybody to have faster development and understand the emphasis in the machinery industry. Sure, we want to be the most sellable oven, but I think it’s also important that the customer can choose and know who the right supplier is for them and the right component, and the right paste supplier. They often choose wrongly and choose ingredients that aren’t right for the process, and make the wrong product. Maybe more communication between all the suppliers will open collaboration that will be helpful.

Las Marias: Communication and collaboration are key.

Wagenfuehr: Yes, correct.

Las Marias: Thank you very much, Ralf.

Wagenfuehr: Thank you.



Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Copyright © 2019 I-Connect007. All rights reserved.