Hutchins Grant Award Winner Announced


Reading time ( words)

During the 2017 Annual Meeting at SMTA International, the SMTA announced that Stephanie Choquette, a graduate student at Iowa State University, has been selected as the recipient of the 2017 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections."

Stephanie expects to graduate from Iowa State University with her Ph.D. in May of 2018. She received her bachelor's degree in Materials Engineering from Iowa State University in 2014.

The Charles Hutchins Educational Grant was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins. The $5,000 grant has been presented annually since 1998 to a full time graduate-level student pursuing a degree and working on thesis research in electronics assembly, electronics packaging, or a related field.

The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, Illinois, September 17–21. The 2018 grant will be presented at SMTAI in Rosemont, Illinois, October 14–18, 2018.

Share


Suggested Items

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

10/30/2017 | Stephen Las Marias, I-Connect007
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.

Top Five BGA Challenges to Overcome

10/09/2017 | Bob Wettermann, BEST Inc.
Higher reflow temperatures of lead-free rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.



Copyright © 2017 I-Connect007. All rights reserved.