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Industry expert Dr. Jennie Hwang, CEO of H-Technologies Group, will talk about solder joint voids at two 90-minute SMTA Webtorial sessions on November 1 and 2, from 1:00pm to 2:30pm ET.
This webtorial provides a holistic overview on solder joint voids. Four fronts in the industry have rekindled the interest and/or concerns about solder joint voids – the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics comprising “delicate” solder joints; and the increased demand in solder joint reliability for high performance and high reliability products. Different sources of solder joint voids, and their respective causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance, and the steps to minimize solder joint voids of both the array solder ball solder joints (e.g., PoP, BGA, CSP) and lead-frame solder joints (e.g., QFP, BTC) will also be outlined. The webtorial will conclude with the source of voids that is most critical to reliability, thus to avoid.
The webtorial provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers.
Registrations are being taken through the SMTA Online Registration System. To register, click here.