Dr. Jennie Hwang to Discuss Solder Joint Voids at SMTA Webtorial Sessions


Reading time ( words)

Industry expert Dr. Jennie Hwang, CEO of H-Technologies Group, will talk about solder joint voids at two 90-minute SMTA Webtorial sessions on November 1 and 2, from 1:00pm to 2:30pm ET.

This webtorial provides a holistic overview on solder joint voids. Four fronts in the industry have rekindled the interest and/or concerns about solder joint voids – the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics comprising “delicate” solder joints; and the increased demand in solder joint reliability for high performance and high reliability products. Different sources of solder joint voids, and their respective causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance, and the steps to minimize solder joint voids of both the array solder ball solder joints (e.g., PoP, BGA, CSP) and lead-frame solder joints (e.g., QFP, BTC) will also be outlined. The webtorial will conclude with the source of voids that is most critical to reliability, thus to avoid.

The webtorial provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers.

Registrations are being taken through the SMTA Online Registration System. To register, click here.

Share


Suggested Items

The Vital Role of Solder Paste Printing in New Product Introduction

02/22/2018 | Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.

Working with Customers: A Consultant's Perspective

02/19/2018 | Stephen Las Marias, I-Connect007
Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.

SuperDry’s Novel Approach to the Drying Process

02/07/2018 | Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.



Copyright © 2018 I-Connect007. All rights reserved.