STI Electronics Supports Local Students with the Jim D. Raby Scholarship


Reading time ( words)

STI Electronics, Inc. is pleased to announce the recipient of the 2017 Jim D. Raby Scholarship. This year’s recipient was Broxton Sanderson, a student at the local Calhoun Community College with locations in Decatur and Huntsville, Alabama.

The annual scholarship is awarded to a student enrolled in a technical program at Calhoun Community College and is based on multiple economic factors. STI helped to set the criteria but is not involved in the selection process.

The Jim D. Raby scholarship program was established in 2004. The Raby family wanted to provide a scholarship to a student that exemplified determination and a strong work ethic while being enrolled in an advanced manufacturing program.

“This is the perfect legacy for my father,” said David Raby, President/CEO. “It encourages and reflects the beliefs and values that he demonstrated throughout his life.”

STI believes in education and is proud to support students at its local college. If you would like to join STI in supporting the Jim D. Raby/STI Scholarship Fund, checks should be made payable to Calhoun Foundation and mailed to: Calhoun Foundation, Calhoun Community College; P. O. Box 2216, Decatur, AL 35609-2216. Please include a cover letter with the check or donation stating the check is for the Jim D. Raby/STI Scholarship Fund.

About STI Electronics, Inc.

Since 1982, STI Electronics, Inc. (STI) has been the premier full-service organization for training, consulting, laboratory analysis, prototyping, and small-to-medium volume contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. For more information, click here.

 

 

Share


Suggested Items

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.

DFx on High-Density Assemblies

12/01/2017 | Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.



Copyright © 2017 I-Connect007. All rights reserved.