Alpha Solder Preforms Prevent Die Tilt with Consistent Bondline Thickness


Reading time ( words)

Alpha Assembly Solutions is introducing ALPHA TrueHeight Preforms, a solder preform engineered with embedded spacer technology that can address all major applications requiring 75µm bondline and above.

ALPHA TrueHeight Preforms are engineered with simplicity in mind to allow ease of implementation and maximum soldering performance. The architecture of the design not only addresses the bondline thickness requirement, but also reduces the opportunity for voiding.  The design minimizes areas where gases can be trapped, compared to other technologies, during the reflow process.

"Engineers can be confident of achieving their design goals during manufacturing when using ALPHA TrueHeight Preforms," said Eric Poh, Regional Product Manager for Solder Preforms at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. "TrueHeight Preforms have the advantage of flexible spacer positioning, so strategic locations can be chosen to ensure consistent bondline thickness."

ALPHA TrueHeight Preforms can be flux coated as well from a wide selection of fluxes.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.

Share


Suggested Items

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2017 I-Connect007. All rights reserved.