Cleaning Trends: The Challenges of Miniaturization and Proximity

Reading time ( words)

Goldman: Now how about getting underneath the components and cleaning. Is that challenging?

Wissel: It is. Dr. Mike Bixenman will refer to it as the Z-axis. Five years ago, it was not uncommon to have something with a 3-, 4-, 5-mil gap, where the cleaner could easily penetrate underneath. Now components are often flush to the surface with only a half a mil standoff for LGAs or QFNs. QFNs are especially challenging packages because they have a large ground plane underneath which obstructs fluid from flushing under the package from one side to the other.

Goldman: How can it get in there where you need it—and then get the cleaner out again. Another challenge.

Wissel: Again, it comes back to collaboration. For a successful cleaning process, I use the analogy of a three-legged stool. The machine maker must be involved, along with the solder paste company and the cleaning agent company. Because between those three things, the customer has to have a soldering material that they can build a reliable part with. Then they have to have a cleaning agent that will remove the flux, and a process that successfully implements that cleaning agent. Without all three of those things working together, success is unlikely.

There is continuous R&D on all fronts: solder paste material sets, on cleaning material agent material sets, and innovation in the machines to deliver that cleaning agent to where the soil is. It’s a fun industry, and no day is ever the same. No day is dull.

Goldman: Very interesting! Ram, thanks again for speaking with me today.

Wissel: You are welcome.



Suggested Items

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

MTV Offers Solder Paste Testing Solution

06/17/2020 | Nolan Johnson, I-Connect007
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

TQM: The Tyranny of the Urgent

06/10/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.

Copyright © 2020 I-Connect007. All rights reserved.