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The November 2017 issue of SMT Magazine is available now. For this edition, we looked at the different challenges PCB assemblers face when dealing with HDI boards, and strategies to address them. One of the things we found out is that communication between the assemblers and designers right from the very start will help improve the manufacturing process.
Read the November issue of SMT Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
Be sure to download the PDF version for future reference.
David Prunier, MC Assembly
One of the more common challenges we see in the EMS world is that through the outsourcing of their manufacturing, many OEMs have forgotten the fundamentals of supply chain management and expect quick turnaround on orders without taking into consideration the whole supply chain constraints or the impact of not providing accurate forecasts to the EMS partner.
Robert Voigt, DDM Novastar
In the previous three chapters on selective soldering, Robert Voigt covered the different applications well-suited to this technology, the various types of fluxing and soldering methods available, and nitrogen inerting. In this chapter, he discusses programming software, and how you can figure out the best sequence to optimize production speed.
Scott Sentz, AEM Inc.
Into decade number two of the European Union’s RoHS and REACH restrictions for the use of lead in electronic components, the risk of tin whiskers in critical circuitry continues. This article will explore a tin whisker mitigation process for surface mount electronic components applicable to both passive and active components.