Goepel electronic's New Detector for Flexible Automated X-ray Inspection


Reading time ( words)

Goepel electronic's StingRay Detector is the name of the new image acquisition concept for fully automatic X-ray inspection of single-sided and double-sided PCBs. It enables selective 2D, 2.5D and 3D X-ray inspection with high image quality at highest speed. The StingRay Detector is another option for the inline AXI systems of the X Line · 3D family.

Goepel-article1117.jpgThe new technology ensures even better layer separation and brilliant, high-resolution images, especially on 3D images of selected areas. The detector concept consisting of a high-speed X/Y axis and a flat-panel detector keeps the balance between image quality and cycle time. The focus is on the reliable inspection of challenging solder joints such as BGAs, QFNs and LGAs. By a scalable number of acquired projections, a high quality of the layer separation is achieved. The 3D reconstruction of the images is done by the planar CT.

The StingRay Detector can be configured according to the inspection task. For example, a total of three detector sizes with a resolution of 1.3 to 6 megapixels are available. In addition to the stepless height adjustment of the X-ray source, the detector distance to the module can also be varied in three steps. This results in different image field sizes and resolutions depending on the specific requirements.

The StingRay Detector addresses users with a test strategy that requires reliable inspection of individual assembly areas at top speed. In contrast to this, the MultiAngle Detector for the X Line · 3D family realizes a full-surface X-ray inspection of all solder joints on the entire board with a scanning image acquisition.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.