AIM Promotes Rodrigo Cacho to Business Development Manager


Reading time ( words)

AIM Solder has promoted Rodrigo Cacho to the position of business development manager. Cacho will be responsible for the development, maintenance, and expansion of product sales to multinational customers throughout the world.

In his most recent role with the company as Latin America Sales Manager, Cacho provided unsurpassed support to customers within the region, solidifying AIM's presence in Latin America and positioning the company for success. Cacho will transition into his new role as business development manager over the next few months, working with the sales team to ensure customers within the region a seamless transition.

"Since joining AIM in 2004, Rodrigo has been a key contributor to AIM’s continued success," said AIM's Vice President - Sales, Andy Dolan. "We are confident that his experience will allow him to excel in his new role."

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2017 I-Connect007. All rights reserved.