Alpha Hosts SMTA Western Pennsylvania Chapter Meeting on Solder Paste Rheology and Recycling Solder Dross


Reading time ( words)

Alpha Assembly Solutions is hosting the SMTA Western Pennsylvania Chapter Meeting Thursday, November 9, at Alpha's Altoona, Pennsylvania manufacturing location.

The day's agenda is organized around the technical presentation to be given by Alpha’s Director of Reclaim Business, Mitch Holtzer, titled "Solder Paste Rheology and Recycling Solder Dross". Following the presentation, there will be a tour of Alpha’s manufacturing and recycling facilties and a round table discussion on current challenges in today’s EMS industries. “Alpha is committed to promoting responsible recycling and providing our customers with cost-efficient options to dispose of their solder dross and waste," said Mitch Holtzer. "We are looking forward to the opportunity to demonstrate our reclaim capabilities to the SMTA chapter members at this meeting."

ALPHA Recycling Services offers electronic assemblers the safest, most efficient, environmentally-compliant solution for turning production waste streams into revenue for its customers. Capable of processing all varieties of waste materials, Alpha has the technological edge for maximizing the recycling of solder paste and related solder paste debris, including used jars, dispensers, and stencil cleaning paper.

Alpha takes pride in helping customers minimize their environmental liability while maximizing the financial return for their reclamation efforts, and ensuring that no materials processed through ALPHA Recycling Services are ever sent to a landfill.

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, visit www.smta.org.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.