Solder Preforms 101: Ask the Expert


Reading time ( words)

Goldman: That's very good because I understand 25% voiding is often considered acceptable.

Sidone: You're absolutely right. In fact, 50% in a lot of cases is acceptable. But this preform system is for customers who have inconsistent voiding or are looking to reduce their average voiding to 20% or less.

Goldman: Since you are now past beta testing, you can now start to get some real production data to add to your knowledge base.

Sidone: That’s right. We are in production with the technology, today. Like I said, it's very compelling and we're excited about it.

Goldman: Now, are these preforms in multiple sizes or shapes? Of course, each reel would have a particular size or shape, correct?

Sidone: Yes, but our studies have allowed us the flexibility to choose a single preform size across multiple component sizes thus reducing inventory for our customers. And this new preform system will develop over time as we continue to collect data and build our matrix of solutions to bring to our customers.

Goldman: That's very interesting.

Sidone: We're excited about it.

Goldman: Jerry, thanks again for joining me today.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.