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Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON Japan 2018, January 17-19, in Tokyo, Japan.
Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:
- Increases lateral strength
- Maintains bondline co-planarity
- Improves thermal cycling reliability
For more information about InFORMS, click here or stop to see us at the show at booth #E27-10.
Patty Goldman, I-Connect007
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