Indium Features InFORMS Reinforced Solder Ribbon for Automated Assembly at NEPCON Japan 2018


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Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON Japan 2018, January 17-19, in Tokyo, Japan.

Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:

  • Increases lateral strength
  • Maintains bondline co-planarity
  • Improves thermal cycling reliability

For more information about InFORMS, click here or stop to see us at the show at booth #E27-10.

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