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Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON Japan 2018, January 17-19, in Tokyo, Japan.
Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:
- Increases lateral strength
- Maintains bondline co-planarity
- Improves thermal cycling reliability
For more information about InFORMS, click here or stop to see us at the show at booth #E27-10.
Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.
Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.
Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.