Libra Industries Installs Another 3D Post Reflow AOI System at its Dallas Facility


Reading time ( words)

Libra Industries has received and completed the installation of a second Omron VT-S730 3D Post Reflow AOI system at its Dallas, Texas facility. With the new 3D-SJI combo technology, Libra Industries can easily detect lifted lead, lifted component and component coplanarity, and provide high-quality solder joint inspection.

Libra Industries has implemented the new high performance, high-speed inspection system to provide its customers with high quality SMT production. The company can certify its SMT production with full IPC standard compliance using Omron’s new 3D-SJI technology.

This is not just another Phase Shift Machine. It is much more than that and the inspection capability of this new machine is amongst the highest available on the market today. The VT-S730 features color highlight™ 3D solder shape reconstruction technology, as well as specific phase shift inspection technology that makes it a highly efficient inspection system.

Libra Industries continues to invest to provide customized manufacturing solutions to help make its customers more competitive and improve their profitability.

About Libra Industries

Libra Industries is a leading provider of integrated Electronic Manufacturing Services (EMS), serving OEMs with complex or technologically sophisticated manufacturing requirements in a broad range of industries including industrial automation, medical, military and aerospace, instrumentation and LED lighting. Four world-class manufacturing facilities allow Libra Industries to provide customers with manufacturing flexibility including complete system build, module and subassembly production, as well as simple to complex PC board assembly. With an ongoing commitment to investment in people, quality systems, and the latest manufacturing equipment and processes, Libra Industries is committed to managing their clients’ products from initial design and prototype to full production; assisting their clients in their efforts to improve time to market, reduce total systems cost, and increase quality.

For more information, click here.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.