Reading time ( words)
From the productronica 2017 show floor, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series. He also talks about their recent acquisitions, and the synergies that they offer the company. Key equipment highlighted includes the MYD50 in-line dispensing system and the MY700 solder paste jetting system.
Watch The Interview Here:
Share
PrintSuggested Items
3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0
06/21/2019 |
Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.
Goepel electronic Solutions, Webinar Series, and Trends
06/19/2019 |
Barry Matties, I-Connect007
Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.
The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues
06/13/2019 |
David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.
