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At the show floor of productronica 2017, I-Connect007 Technical Editor Pete Starkey speaks with Managing Director Harald Eppinger of Koh Young Europe GmbH about the principles of Koh Young’s total 3D inspection solution for SMT process optimization and yield improvement. He highlights the importance of process transparency and visibility to provide the right information, to make the right action to prevent defects. Eppinger also mentions the significant improvement in connector pin inspection in their systems, driven by demand from the automotive electronics industry.
Watch The Interview Here:
Click here for more coverage from productronica 2017.
KIC announced that MB (Marybeth) Allen will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, August 23, 2018 at the John Hopkins University/Applied Physics Lab in Laurel, Maryland.
Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.