Video from productronica 2017: Heraeus Highlights Need for Highly Reliable and Compatible Assembly Materials


Reading time ( words)

At the recent productronica 2017 event in Munich, Germany, Stefan Merlau, global product manager of assembly materials for Heraeus Electronics, discusses with I-Connect007 Managing Editor Andy Shaughnessy the biggest pain points of their customers, and how his company’s latest technologies are helping them address these issues. He also speaks about their outlook for the industry going into the new year.

Watch The Interview Here:

Click here for more coverage from productronica 2017.

Share

Print


Suggested Items

Innovative Battery and Pressure Sensor Technologies

04/19/2019 | Nolan Johnson, I-Connect007
Tracy Liu is the director of R&D of the Nano and Advanced Materials Institute (NAMI) in Hong Kong. In an interview with I-Connect007, Liu talked about NAMI and discussed a number of battery and pressure sensor technologies being developed by the institute for licensing.

Impact of 5G

03/27/2019 | I-Connect007 Research Team
In our recent I-Connect007 survey on 5G, we asked the following question: "How do you think 5G will impact the electronics manufacturing industry?" Below are some of the replies, edited slightly for clarity.

The Future of the Customer Experience in Mobility

01/16/2019 | Nolan Johnson, I-Connect007
Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.



Copyright © 2019 I-Connect007. All rights reserved.