Video from productronica 2017: Heraeus Highlights Need for Highly Reliable and Compatible Assembly Materials

Reading time ( words)

At the recent productronica 2017 event in Munich, Germany, Stefan Merlau, global product manager of assembly materials for Heraeus Electronics, discusses with I-Connect007 Managing Editor Andy Shaughnessy the biggest pain points of their customers, and how his company’s latest technologies are helping them address these issues. He also speaks about their outlook for the industry going into the new year.

Watch The Interview Here:

Click here for more coverage from productronica 2017.

01/16/2019 | Nolan Johnson, I-Connect007

Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.

01/14/2019 | Nolan Johnson, I-Connect007

Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.

10/02/2018 | Real Time With... NEPCON South China

Andreas Reinhardt, R&D director at SEHO Systems GmbH, speaks about their new production facility in South Korea, which aims to address the growing lead times in their supply chain. He also talks about how emerging technologies such as more and more sensors and connections, big data, and cloud computing are impacting the electronics assembly industry.