Digicom Electronics to Showcase Capabilities at BIOMEDevice


Reading time ( words)

Digicom Electronics Inc. will present ways to mitigate device failure in manufacturing processes, at the BIOMEDevice Show, which will be held December 67, at the San Jose Convention Center in San Jose, California. In addition, Digicom will be celebrating its 35th year in the California Bay Area.

"Device failure can often be attributed to printed circuit board contamination or problems with the solder joints," explained Mo Ohady, general manager of Digicom Electronics. "Digicom has spent several years researching ways to produce ultra-clean boards and to build-in reliability throughout the assembly process. We developed a proprietary Diamond Track Cleaning Process, which independent testing agencies verify produces boards with zero ion contamination. In addition, studies show a 50-60% reduction in defect level when using nitrogen in the reflow process. Digicom generates its own nitrogen and pipes it to all our soldering processes, including hand, reflow, and selective soldering. 100% of our boards are inspected. We feel that it's essential that an EMS company take every step to ensure the integrity of the devices they prototype and assemble."

Digicom helps companies with their complete process from design review through prototyping, component sourcing, manufacture, test, and process validation. It has been recognized as one of the first companies to have been certified for the new AS9100:2016 (Rev D) aerospace quality and ISO 9001:2015 standards, and has ISO 13485:2003 medical devices quality, quality system regulation 21 CFR 820, ITAR, and numerous other certifications.

Digicom will be in Booth 327.

About Digicom Electronics 

Digicom Electronics offers advanced electronics manufacturing with "Made in the USA" quality that fits the needs of larger enterprises while at the same time providing the benefits and individual attention needed to serve start-up companies. Digicom collaborates in all aspects of the process from the design for manufacturability to the final, fully compliant product. Material procurement and management services include planning, purchasing, expediting, and warehousing of components and materials. Digicom has AS9100:2016 RevD, ISO 9001:2015, ISO 13485:2003 medical devices quality, quality system regulation 21 CFR 820, ITAR, AS9100, and numerous other certifications. For more information, click here.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.