Engineered Material Systems Intros Low-Temp Cure Conductive Adhesive


Reading time ( words)

Engineered Material Systems' newly launched CA-183 low-temperature cure electrically conductive adhesive is designed for die attach and general circuit assembly applications.

The CA-183 cures in 60 minutes at 80°C, 20 minutes at 100°C, or 30 seconds at 150°C, and has an electrical conductivity of 9 x 10-4 ohm-cm. This material is ideal for applications where the components are temperature sensitive and require high conductivity interconnects. CA-183 has a 48-hour work-life and a 26,000 cP viscosity at 5rpm for easy needle dispensing or application by pin transfer.

The adhesive was developed to pass the rigorous reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications. CA-183 is the latest addition to Engineered Material Systems extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

About Engineered Material Systems

Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, click here.

Share


Suggested Items

RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow

09/13/2017 | Real Time With... NEPCON South China
Ralf Wagenfuehr of Rehm Thermal Systems speaks about the need for a common communications platform as the industry moves toward Industry 4.0. He also talks about how their new ViCON software can help manufacturers achieve the smart factory vision.

Cybersecurity: 4 Things OEMs Should Do to Protect Themselves

09/01/2017 | Neil Sharp, JJS Manufacturing
Manufacturing has been declared one of the top three most targeted industries for cyber attacks. While Industry 4.0 and expansion into cyber-physical systems will have a positive impact on the industry in terms of increasing efficiency, they open the door to even more security risks such as a hacker taking over production, or changing the output of the manufacturing process.

On the Smart Move: Industry 4.0 in Electronics Production

08/25/2017 | Günter Schindler, ASM Assembly Systems GmbH & Co. KG
The industrial world is in motion, as we face a revolution in terms of processes, organizational structures, hardware and software in our companies. Many critics complain that terms like Industry 4.0 and smart factory are rather arbitrary and lack concrete meaning. That is correct. What is also true, however, is that technical progress always starts out with a vision, which is then put into concrete terms as time moves on.



Copyright © 2017 I-Connect007. All rights reserved.