December Issue of SMT Magazine Available Now


Reading time ( words)

The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.

Read the December issue of SMT Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.

Be sure to download the PDF version for future reference.

Share


Suggested Items

The Vital Role of Solder Paste Printing in New Product Introduction

02/22/2018 | Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.

Working with Customers: A Consultant's Perspective

02/19/2018 | Stephen Las Marias, I-Connect007
Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.

SuperDry’s Novel Approach to the Drying Process

02/07/2018 | Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.



Copyright © 2018 I-Connect007. All rights reserved.