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The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.
Read the December issue of SMT Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
Be sure to download the PDF version for future reference.
Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Happy Holden, I-Connect007
At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.
Real Time with... NEPCON China
At the recent NEPCON China 2018 event in Shanghai, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve the solder paste printing process and ensure first pass yields.