AIM to Host SMT High-Reliability Technology Seminar in China


Reading time ( words)

AIM Solder will co-host the SMT Electronics Assembly High-Reliability Technology Seminar in Shenzhen, China on December 8, 2017. AIM will present two of its most recent papers at the seminar.

Derek Wang, Technical Support Manager, will present the white paper titled “An In-Depth Look at a New Low Cost and High-Reliability Alloy Alternative to SAC305 and Low-/No-Silver Alloys.” His presentation will cover the evolution of lead-free soldering and the limitations of SAC305, the current standard for lead-free electronics soldering. It will explore the effects of nickel, bismuth and other micro-alloy dopants on mechanical and soldering performance.

Flopy Feng, Technical Support Engineer, will present AIM’s paper “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance,” which highlights the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. In this study, the key input variables included powder size, effect of room temperature storage, pause time and PCB feature types.  Output included print transfer efficiency, volume repeatability and performance stability over time.

This free seminar, hosted by AIM, Axxon, Mycronic, and Zestron, will be held at the Silicon Valley Power Vehicle Electronic Business Park in Shenzhen, China. For more information, please contact Michelle Peng via email at mpeng@aimsolder.com or by phone at 130-6694-5432. 

About the Presenters

Derek Wang is a Technical Support Manager for AIM Solder. He is a SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over thirteen years’ experience in the SMT industry, Derek supports AIM customers in Eastern China.

Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China. 

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.

Share


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Indium on Voiding and Auto Electronics Test Standard

10/09/2018 | Stephen Las Marias, I-Connect007
In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.

RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering

09/28/2018 | Real Time With... NEPCON South China
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.



Copyright © 2018 I-Connect007. All rights reserved.