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SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
The technical sessions, with over 50 presentations, will include Automotive Systems and Hardware, Materials and Reliability, Inspection and Test Techniques, Cleaning Technologies, Advanced Materials, Interposer and Packaging Technology, Advanced Processes and Packaging, Nontechnology Applications, Advanced Packaging and Processes, Advanced Process, Heterogeneous Integration.
On the afternoon of Monday, February 5, a plenary keynote session will kick off the event featuring presentations on Defense Electronics; The Latest Material Technologies for Systems in Package; Management of Complexity in Research and Development Work; and Selected Highlights From the 2017 iNEMI Roadmap and Key Projects to Address Identified Gaps.
On Tuesday, February 6, Yoshiaki Sakagami, Honda, will deliver the keynote lunch talk on “Honda’s New Mobility System Development Challenge; Key Functions and Devices for Intelligent Mobility System.” On Wednesday, February 7, Dwight Howard, Delphi Automotive, LLC, will deliver the lunch keynote on “Integrated Intelligent Transportation and Key Enablers.” Dongkai Shangguan, Ph.D., Flex, will deliver the final keynote lunch presentation about “Cost Effective Solutions for SiP and Miniaturized Modules” on Thursday, February 8.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.