Alpha Introduces Ultrafine Cored Wire for Fine-Pitch Component Soldering and Rework


Reading time ( words)

Alpha Assembly Solutions is introducing ALPHA SAC305 Ultrafine Cored Wire for use in attaching or repairing very fine pitch components approaching 0.20mm.

“With the increase of solder joint density and miniaturization, ALPHA SAC305 Ultrafine Cored Wire is an ideal solution where solder paste reflow or other soldering applications are not compatible to the design,” said Bernice Chung, Global Portfolio Manager for Wave Soldering at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “Fine pitch PCB assemblies have higher quality and reliability standards, which requires precise solder wire feeding volume and non-skip solder feeding. Ultrafine cored wire delivers consistent diameter size and flux continuity to ensure unfailing wire feeding, especially in robotic soldering, such as laser soldering technologies.”

ALPHA SAC305 Ultrafine Cored Wire offers fast soldering performance and has passed the most stringent reliability tests. It can be used for any customer who has previously approved larger diameter wire using ALPHA Telecore HF-850, Telecore XL-825 or Telecore Plus core fluxes. Provided in cored wire for convenient use, ALPHA SAC305 Ultrafine Cored Wire is available in 0.2mm, 0.15mm and 0.1mm to fit different process requirements.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

Share


Suggested Items

Top 10 Most-Read SMT Articles of 2017

12/29/2017 | I-Connect007
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.

Evaluation of Stencil Technology for Miniaturization

12/22/2017 | Neeta Agarwal, et al.*
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.



Copyright © 2018 I-Connect007. All rights reserved.