Ellsworth Expands Portfolio of Metcal Soldering Products


Reading time ( words)

Ellsworth Adhesives Europe is pleased to announce the addition of the Metcal CV-5200 Connection Validation Soldering Station to its range of soldering products.

Manufactured with an embedded, self-regulating heater, Metcal CV-5200 has been developed to deliver the desired amount of power based on the requirements of the solder joint whilst ensuring a fast, safe and repeatable process with no calibration required.

The introduction of its Connection Validation software is an industry first - offering not only control of the tip temperature but also smooth operation in real time with closed loop feedback via a green or red light integrated into the handpiece, to indicate intermetallic compound formation.

Metcal CV-5200 is designed to deliver the right amount of power based on the requirements of the solder joint using SmartHeat technology. SmartHeat technology is built-in to all Metcal soldering systems to automatically ensure a consistent soldering iron tip temperature under a wide range of thermal loads, practically without external adjustments.

With the additional advantage of repeatability and a measurable standard to enhance the soldering process, Metcal CV-5200 complements the skill of the operator to determine the quality of the solder joint whilst ensuring an objective method of evaluating the solder joint as a whole.

A unique feature of this soldering system is its ability to evaluate the quality of the solder joint by calculating the intermetallic compound formation and offering feedback to the operator. By doing so, Connection Validation takes the risks associated with soldering out of the hands of the operator, yet assuring a good solder joint.

Branded as the next big step in soldering process control, the CV-5200 model offers the user many further advantages including improved quality and mitigated risk, enhanced process control and improved compliance. Metcal CV-5200 is particularly advantageous in the production of automotive, aerospace, military and medical device products.

About Ellsworth Adhesives Europe

Ellsworth Adhesives Europe is the regional arm of American owned global entity, The Ellsworth Corporation. Across Europe, Ellsworth Adhesives has branches in France, Spain, Germany, Scandinavia and the United Kingdom, where our headquarters is located.

As a distributor of adhesives, specialty chemicals and adhesive dispensing equipment, the Ellsworth Adhesives product portfolio is huge and encompasses all of the industry’s leading brands including Loctite, Dow Corning, Dymax, Lord and many more.

From epoxy adhesives and potting systems, to conformal coatings and surface preparation products, Ellsworth Adhesives has a material to suit every application. Alongside adhesive materials, Ellsworth also supplies a wide range of manual and automated adhesive dispensing equipment including tips, cartridges and static mixers, as well as dispensers and dispensing robots.

To learn more about Ellsworth Adhesives, click here.

 

Share


Suggested Items

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance

12/28/2017 | Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.



Copyright © 2018 I-Connect007. All rights reserved.