Alpha to Showcase Die Attach and SMT Solutions at Internepcon Japan 2018


Reading time ( words)

Alpha Assembly Solutions will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the 2018 Internepcon Japan show to be held in Tokyo from January 17-19, 2018.

At the show, Alpha, a part of the MacDermid Performance Solutions group of business, will be exhibiting its latest range of products for SMT assembly Solutions, die attach assembly solutions and industrial assembly solutions. The products include Agromax, Atrox, High Temperature Dipping Alloys, Low Melting Point Solder Paste, Assembly Polymers, Innolot Alloys, PowerBond and AccuFlux.

In addition, Alpha will showcase its newly developed solution for void reduction under bottom terminated components (BTC), the ALPHA AccuFlux BTC-578 Preform System. The system combines ALPHA AccuFlux BTC-578 Preform, solder paste, engineered stencil designs and optimized processing parameters to dramatically and consistently decrease voiding.

For more information on Alpha's latest product technologies, visit Alpha Assembly Solutions Booth at Internepcon Japan Hall East 5-4.

About 47th Internepcon Japan

Internepcon Japan is the world’s leading SMT exhibition gathering Equipment, Solutions and Services for Electronics Manufacturing. For more information, click here.

Date: Wednesday 17th – Friday 19th January 2018 (10:00-18:00, Last Day until 17:00)
Venue: Tokyo Big Sight, Japan

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.

Share


Suggested Items

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Tackling Reliability Challenges in Low-Temperature Soldering

07/18/2018 | Barry Matties and Stephen Las Marias, I-Connect007
William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

07/11/2018 | Stephen Las Marias, I-Connect007
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.



Copyright © 2018 I-Connect007. All rights reserved.