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Many through-hole components are manually inserted, and hand soldered into SMT assemblies. This media training program will teach your operators and technicians best industry practices to make sure the job is performed properly and efficiently.
This new video demonstrates manual preparation and hand soldering for through-hole components, including axial, radial and multi-leaded components.
Contents include lead straightening, lead forming, lead clinching, stress relief bends, polarity, wetting, vertical mount components, spacers, DIP lead preparation/straightening and hand soldering.
Through-hole component prep and hand soldering provide the visual training your operators need to safely prepare and install through-hole components onto electronic assemblies, to help reduce costly and time-consuming rework, repairs and scrap.
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Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Duane Benson, Screaming Circuits
There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues. If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.
Glen Thomas, Ph.D., and Bill Cardoso, Ph.D., Creative Electron Inc.
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?