Indium to Feature New Solder Paste at IPC APEX EXPO 2018


Reading time ( words)

Indium Corporation will feature Indium11.8HF-SPR Solder Paste, a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers, at IPC APEX EXPO 2018, which will be held February 24–March 1 in San Diego, California.

Indium11.8HF-SPR specifically addresses customers’ needs for Type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance. 

Indium11.8HF-SPR benefits:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • High-transfer efficiency through small apertures (≤ 0.66AR)
  • Long stencil life (>12 hours)
  • Eliminates hot and cold slump to inhibit bridging and solder beading defects
  • Avoids the potential for HIP and graping defects with a unique oxidation barrier

To learn more about Indium11.8HF-SPR, visit Indium Corporation at the show at booth #1625.

For more information about Indium Corporation, click here.

Share


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.



Copyright © 2018 I-Connect007. All rights reserved.