Indium to Feature New Solder Paste at IPC APEX EXPO 2018


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Indium Corporation will feature Indium11.8HF-SPR Solder Paste, a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers, at IPC APEX EXPO 2018, which will be held February 24–March 1 in San Diego, California.

Indium11.8HF-SPR specifically addresses customers’ needs for Type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance. 

Indium11.8HF-SPR benefits:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • High-transfer efficiency through small apertures (≤ 0.66AR)
  • Long stencil life (>12 hours)
  • Eliminates hot and cold slump to inhibit bridging and solder beading defects
  • Avoids the potential for HIP and graping defects with a unique oxidation barrier

To learn more about Indium11.8HF-SPR, visit Indium Corporation at the show at booth #1625.

For more information about Indium Corporation, click here.

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