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As more and more assemblers consider post-reflow cleaning of circuit assemblies, many are presented with numerous cleaning questions. In line with this, Aqueous Technologies will kick off its 2018 Tech Tuesday Webinar series with “A Beginner’s Guide to Cleaning Circuit Assemblies.”
This webinar is designed to “begin at the beginning.” Several cleaning related topics will be reviewed including the reasons for cleaning, contamination related failure mechanisms, cleaning methods and costs, and cleaning best practices for 2018.
The one-hour technical webinar, to be held January 9, 2018, from 8:00am to 9:00am, will be presented live by Mike Konrad, an SMTA "Distinguished Speaker," and is offered free of charge.
For more information or to register, click here.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Stephen Las Marias, I-Connect007
Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.
Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.