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As more and more assemblers consider post-reflow cleaning of circuit assemblies, many are presented with numerous cleaning questions. In line with this, Aqueous Technologies will kick off its 2018 Tech Tuesday Webinar series with “A Beginner’s Guide to Cleaning Circuit Assemblies.”
This webinar is designed to “begin at the beginning.” Several cleaning related topics will be reviewed including the reasons for cleaning, contamination related failure mechanisms, cleaning methods and costs, and cleaning best practices for 2018.
The one-hour technical webinar, to be held January 9, 2018, from 8:00am to 9:00am, will be presented live by Mike Konrad, an SMTA "Distinguished Speaker," and is offered free of charge.
For more information or to register, click here.
Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.
Stephen Las Marias, I-Connect007
In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.