Focus on the New


Reading time ( words)

Hello, 2018! Wow, it seems like it wasn’t too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018.

First things first!

I am sure you have noticed our name has changed from SMT Magazine to SMT007 Magazine. Not only did we update our magazine’s name, we also refreshed the interior pages of the publication, as well. As an I-Connect007 publication, SMT007 Magazine fits nicely with our other publications, which also carry through with the naming convention starting this month: PCB007 Magazine and Design007 Magazine. We hope you enjoy this fresh new look.

What else have we been up to?

Last month, our team attended the HKPCA & IPC Show in Shenzhen, China, to talk to industry leaders in the PCB supply chain about trends and technologies to watch for in the coming year.

The consensus is that everyone’s excited about the continuing growth in the electronics assembly industry. Last year, the industry was beset with the copper foil shortage. While the same shortage can be expected this year, given the strong growth of the automotive electronics industry, manufacturers and suppliers remain bullish that this same growth will fuel other aspects of the electronics manufacturing industry.

Show attendees and vendors were also generally excited about 5G, highlighting the pilot deployment of the first 5G network at the 2018 Winter Olympics in South Korea. Other notable technologies with expected growth include medical electronics, and the proliferation of devices for the Internet of Things (IoT).

This Month’s Lineup

In this issue, we have taken a close look at the many facets and considerations associated with investing in new equipment. Do you buy new equipment just to say you have the latest systems in your processing lines? Of course not. But what are the key reasons that will drive you to invest in new equipment, and what decision process goes on behind the scenes that justifies your investment in these new machines?

To read the full version of this article, which appeared in the January 2018 issue of SMT007 Magazine, click here.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.



Copyright © 2019 I-Connect007. All rights reserved.