AIM's Karl Seelig Now an Independent Consultant


Reading time ( words)

AIM Solder has announced that Karl Seelig, VP of Technology, has transitioned to the role of independent consultant as of January 1, 2018. Following a 30-year career at AIM, Seelig will have the opportunity to support industry partners and non-solder companies with his vast knowledge and experience.

In his new role, Seelig will continue work closely with AIM's R&D, technical support, and production teams. He will continue to contribute his extensive knowledge via white papers and presentations at industry conferences.

"We are pleased that Karl will continue to work as a dedicated resource to AIM and our customers," said Ricky Black, president of AIM. "He has been a valuable player in the research and development of many patents in soldering technology over the years. We are very happy for Karl and are excited to continue working with him."

About Karl Seelig

In his career, Seelig has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly & process optimization, inspection, and metallurgical studies. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He has received numerous patents in soldering technology, including four lead-free solder alloys.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance

12/28/2017 | Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.



Copyright © 2018 I-Connect007. All rights reserved.