Yamaha Unveiling Pace-Setting Innovation for Advanced Electronics Assembly


Reading time ( words)

Yamaha Motor Intelligent Machinery (IM) unveiled advanced solutions to current and future assembly challenges at productronica 2017, and will again do so in February at IPC APEX 2018, Booth #2333.

Yamaha’s Total Line Solution concept streamlines and interconnects all stages of SMT PCB assembly; as such it attracted visitors to Productronica from more than 40 different countries across four continents to see the latest in printing, high-speed mounting, high-resolution optical inspection, 3D assembly, and inline robotics. Yamaha’s unique solutions to future challenges, including 3D-MID assembly, and Machine to machine (M2M) communications features of Yamaha’s Factory Tools 4.0 were also on display.

Yamaha’s 3D-MID (Molded Interconnect Devices) solution places SMD components on three-dimensional substrates. This addresses the developing industry demands to build high-density products. Yamaha demonstrated the 3D-MID function on the iPulse M20 hybrid mounter, which also performs conventional SMT placement. This feature delivers a space-efficient solution that makes 3D assembly cost-effective even for low-volume work like prototyping or small batches.

Yamaha also unveiled its new and powerful 3D AOI camera with 7-micron resolution. Such microscopic inspection is essential for assessing solder joints of the tiniest chip components such as 01005 devices, which are now being adopted in high-density applications including Package-in-Package assembly.

The latest Yamaha Factory Tools 4.0 suite provides real-time performance and feeder-status monitoring. These M2M capabilities deliver production data directly to the line supervisor’s desktop monitor or mobile device anywhere in the factory, along with database-driven traceability and statistical process control (SPC).  In total, Factory Tools 4.0 contains over 20 applications covering setup, programming, monitoring, and traceability down to component and nozzle level.

Yamaha also presented the latest models in its YSM family of high-efficiency modular mounters, including the compact single-beam YSM10 with its versatile multi-nozzle head options that deliver class-leading 46,000 cph placement speed. The 1- or 2-beam YSM20 and 2-/4-beam YSM40R with its 18-nozzle, 50,000 cph head provide exceptional speed of up to 200,000cph in a one-meter footprint. Alongside these machines, the high-speed Sigma G5S mounter with advanced automation, high-speed motion controls, and die-feature recognition for optically-accurate LED placement grabbed the attention of buyers seeking fast and flexible capacity extension.

About Yamaha Motor Intelligent Machinery

Yamaha Motor IM is a subdivision of Yamaha Motor Corporation, and has employed its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. Yamaha Motor IM offers a full line of machines for electric/electronic parts mounting and other production-line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America, providing a truly global sales and service network, delivering best in class on-site sales and service support for their customers.

For more information, click here.

Share


Suggested Items

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Configure to Order: Different by Design

01/09/2018 | Michael Ford, Aegis Software Corp.
When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Step Stencil Technologies and Their Effect on the SMT Printing Process

12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.



Copyright © 2018 I-Connect007. All rights reserved.