PACE to Launch Low-Cost Soldering Station at IPC APEX EXPO 2018


Reading time ( words)

PACE Worldwide announces the ADS200, a new high-power, low-cost production soldering station, to be introduced at IPC APEX EXPO 2018, which will be held on February 27-March 1, 2018 at the San Diego Convention Center. The ADS200 features the new TD-200 Cool-Touch Handpiece, with its sleek and ergonomic aluminum handle designed to stay cool and comfortable during continuous production soldering. Its Blue Series Tip-Heater Cartridges integrate a high-accuracy sensor with a robust heater, delivering up to 120W of power. The quick-change cartridges can be quickly swapped while hot, and achieve set temperatures instantly. Yet, the tip cartridges are less than half the price of most other cartridge style or curie point tips.

PACE's new AccuDrive temperature control technology delivers unsurpassed thermal performance and highly accurate temperatures, without the need to change tip cartridges or calibrate. Its advanced electronics provide instantaneous load sensing and on-demand power to quickly reflow solder joints at the lowest, safest temperature required, regardless of the mass of the application. Intended for extreme, multi-shift production use, the ADS200 features a rugged, all-metal design, including housing, soldering iron and tool stand. The system is intuitive and easy to operate – just power it on, set the temperature with arrow keys and start soldering.

About PACE

PACE Worldwide has been providing the most innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Since the dawn of the modern electronics industry, PACE has played a key role in the development of groundbreaking products, training films, curricula, materials and electronic assembly standards, including several soldering, surface mount and through-hole rework videos co-produced with the IPC and industry.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.