Juki Names Greg Lefebvre Regional Sales Manager for the Americas


Reading time ( words)

Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce the appointment of Greg Lefebvre as Regional Sales Manager for the Americas.

Lefebvre brings 25 years of experience managing inside/outside personnel, marketing objectives and sales performance for North and South America. He will help Juki win new business and optimize customer retention with top decision makers through relationship building, trust and knowledge of the product line.

An experienced sales executive, Lefebvre has held roles with respected companies including Motorola and Speedline Technologies. He holds a Bachelor of Science Degree in Mechanical / Industrial Engineering from Purdue University.

About Juki Automation Systems, Inc.

Juki Automation Systems (JAS), is an international leader in high-speed SMT Assembly equipment, has shipped more than 30,000 machines worldwide since 1987.  Juki has built its global image with a combination of top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. Juki machines have about 30 percent U.S. made content by cost. The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high mix environments.  JAS, Inc. employs 45 U.S. employees, including 20 service personnel five specializing in applications sales.

Additionally, JAS, Inc. offers a full line of SMT manufacturing products as wells as selective solder and stamp soldering machines plus Advanced Technology through-hole machines.   Juki supports one of the largest field service groups in the industry.  For more information, click here.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.