Indium Earns ISO/TS 16949 Automotive Certification


Reading time ( words)

Indium Corporation has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters.

“SRI Quality System Registrar (SRI) is pleased to acknowledge that Indium Corporation has demonstrated effective implementation of a management system that satisfies the tough auto standard: ISO/TS 16949,” said Edward L. Maschmeier, Director, Certification. “This certification shows their automotive customers worldwide that Indium Corporation is committed to being recognized as a long-term supplier of quality goods and services.”

Indium Corporation’s Business Park Drive facility in Utica, N.Y., earned an ISO/TS 16949 management certificate for the design and manufacturing of brazing and solder materials as ribbon, wire, preforms, and engineered solders; flux-coated materials; NanoFoil; sputtering target bonding; pure indium metal and fabricated indium metals for electronics assembly.

Indium Corporation’s headquarters and manufacturing operations in Clinton, N.Y., earned certification for the design and manufacture of solder powders, solder pastes, soldering fluxes, epoxy, and related materials for semiconductor manufacturing and electronics assembly.

“Quality, precision, and reliability are core tenets at the heart of every activity at Indium Corporation,” said Ross Berntson, Indium Corporation President and COO. “These certifications are formal evidence of the commitment to quality as a core operating principle since Indium Corporation was founded more than 80 years ago.”

The ISO/TS 16949:2009 is an international technical specification standard aimed at the development of a quality management system that provides for continuous improvement, emphasizing defect prevention, and the reduction of variation and waste in the automotive industry supply chain.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

This Month in SMT007 Magazine—Continuous Improvement: As Simple as X = Xc – 1

01/04/2021 | I-Connect007 Editorial Team
X=Xc – 1 is a conceptual equation for continuous improvement. You define X and work to reduce it by a factor of 1. This could be one work hour, one process step, one day less in a cycle, and so on. We recently met with Dr. Ron Lasky to discuss the concept of X=Xc – 1 and get his advice on generating enthusiasm among readers and the next generation about continuous improvement. As this discussion illustrates, many process improvements are small in scale, not yearlong, major efforts.

Top 10 Most-Read SMT Articles of 2020

12/31/2020 | I-Connect007
As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in SMT from the past year.

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.



Copyright © 2021 I-Connect007. All rights reserved.