Indium Earns ISO/TS 16949 Automotive Certification


Reading time ( words)

Indium Corporation has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters.

“SRI Quality System Registrar (SRI) is pleased to acknowledge that Indium Corporation has demonstrated effective implementation of a management system that satisfies the tough auto standard: ISO/TS 16949,” said Edward L. Maschmeier, Director, Certification. “This certification shows their automotive customers worldwide that Indium Corporation is committed to being recognized as a long-term supplier of quality goods and services.”

Indium Corporation’s Business Park Drive facility in Utica, N.Y., earned an ISO/TS 16949 management certificate for the design and manufacturing of brazing and solder materials as ribbon, wire, preforms, and engineered solders; flux-coated materials; NanoFoil; sputtering target bonding; pure indium metal and fabricated indium metals for electronics assembly.

Indium Corporation’s headquarters and manufacturing operations in Clinton, N.Y., earned certification for the design and manufacture of solder powders, solder pastes, soldering fluxes, epoxy, and related materials for semiconductor manufacturing and electronics assembly.

“Quality, precision, and reliability are core tenets at the heart of every activity at Indium Corporation,” said Ross Berntson, Indium Corporation President and COO. “These certifications are formal evidence of the commitment to quality as a core operating principle since Indium Corporation was founded more than 80 years ago.”

The ISO/TS 16949:2009 is an international technical specification standard aimed at the development of a quality management system that provides for continuous improvement, emphasizing defect prevention, and the reduction of variation and waste in the automotive industry supply chain.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

07/24/2018 | I-Connect007 Research Team
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Is There an End in Sight to the Electronic Components Crisis?

07/12/2018 | Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.



Copyright © 2018 I-Connect007. All rights reserved.