Koh Young Technology's SPI Features New Auto Repair Function


Reading time ( words)

Koh Young Technology helps manufacturers improve quality and productivity by adding automated solder paste dispensing to its KY8030-3 3D SPI (solder paste inspection). The company will demonstrate the high-precision, user-friendly dispensing system on the KY8030-3 at the upcoming IPC APEX Expo 2018, which is scheduled for February 24 to March 1, 2018 at the San Diego Convention Center. Koh Young will be in Booth 2733.

Industry experts agree, screen printing generally accounts for 70−80% of printed circuit board assembly defects. With greater design and assembly challenges, including the widespread use of fine-pitch components and microchips, insufficient solder has become a significant problem. This issue causes multiple challenges like open joints and lean fillets, as well as weak joints susceptible to breaking during subsequent assembly processes, transportation, or even field use. The defect is costly, but can be automatically repaired with the KY8030-3 dispensing solution.

Koh Young has introduced a solution to the problem with its high-performance Auto Repair feature. An integrated dispenser within the KY8030-3 prevents insufficient solder, so manufacturers can reduce its costs by potentially eliminating board scrap or cleaning. Not only does the world's fastest 3D SPI provide accurate inspection with real-time board warp compensation, the KY8030-3 configured with the Auto Repair option enhances first pass yield and reduces operational costs. Koh Young's 3D SPI is more than an inspection system, it is a process optimizer.

Koh Young has considered system maintenance and usability in the Auto Repair system design, which extends the service and cleaning interval to upwards of seven days. For example, the syringe holder incorporates a one-touch release for easy and quick replacement. The minimized maintenance requirements improve the Return on Investment (ROI) by reducing labor and material costs. Additionally, operators can readily verify rework performance by comparing rework result. The system provides both 2D and 3D images of the pads before and after dispensing, so operators can monitor the process to make better decisions.

Koh Young Technology will demonstrate its high-speed KY8030-3 SPI system with the new Auto Repair function at the IPC APEX Expo. What's more, the company will participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at Booth 2377, you can learn more about Koh Young Technology and its best-in-class inspection solutions here.

About Koh Young Technology Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.